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MF-ATL系列貼膜機
    發布時間: 2022-04-13 16:30    

Features

Easy operation and maintenance by soft were are calibration.
6~ 8 inch and 8~12 inch wafer capability.
Tape capable of normal and UV tape.
High accuracy lamination by pre-aligner .
Air bubble free lamination.
Adjustable cutting blade angle.
Precision edge cutting for optimum wafer back-grinding.
No tape burr and tail after lamination.
Minimum tape consumption.
Easy tape setting by one touch locker.
High precise robotic handler.

Quick and easy conversion for different size wafer.

Capable of Bumping wafer by special bond roller.










服務熱線:021-64307580

傳真:021-64306520
郵箱:shanghai@mfinetech.com
地址:上海市金山區春麗路1239號國際中小企業產業園   (二期) 3號樓
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