◆ Easy operation and maintenance by soft
were are calibration. ◆6~ 8 inch and 8~12 inch wafer
capability. ◆Tape capable of normal and UV tape. ◆High accuracy lamination by pre-aligner
. ◆Air bubble free lamination. ◆Adjustable cutting blade angle. ◆Precision edge cutting for optimum wafer
back-grinding. ◆No tape burr and tail after
lamination. ◆Minimum tape consumption. ◆Easy tape setting by one touch
locker. ◆High precise robotic handler.
◆ Quick and easy conversion for different
size wafer.